Hardware and Architectural Support for Security and Privacy (HASP) 2026
in conjunction with MICRO 2026, Oct 31, 2026, Athens, Greece.
Alaa Alameldeen, Simon Fraser University and Ampere Computing, Canada/USA
Kai Bu, Zhejiang University, China
Hafizul Islam Chowdhuryy, University of North Carolina at Charlotte, USA
Yun Chen, HKUST(GZ), China
Lucian Cojocar, Intel, USA
Sanjay Deshpande, Northwestern University, USA
Calvin Deutschbein, Willamette University, USA
Berk Gulmezoglu, Iowa State University, USA
Xiaolong Guo, Lehigh University, USA
David Kaplan, AMD, USA
Kyungtae Kim, Dartmouth College, USA
Sandhya Koteshwara, IBM Research, USA
Mengyuan Li, University of Southern California, USA
Sisheng Liang, Central Michigan University, USA
Qian Lou, University of Central Florida, USA
Mulong Luo, Florida State University, USA
Stefan Saroiu, Microsoft Research, USA
Seonghun Son, Mercer University, USA
Samuel Thomas, Pomona College, USA
Shanquan Tian, Google, USA
Vincent Quentin Ulitzsch, MIT, USA
Zhiwei Wang, Institute of Information Engineering, Chinese Academy of Sciences, China
Yuanchao Xu, University of California, Santa Cruz, USA
Kun Yang, Zhejiang University, China
Fan Yao, University of Central Florida, USA
Jiyong Yu, Tenstorrent USA, USA
Zihao Zhan, Texas Tech University, USA
Mingzhe Zhang, Ant Group, China
Zhenkai Zhang, Clemson University, USA
Zhi Zhang, The University of Western Australia, Australia
Lutan Zhao, Institute of Information Engineering, Chinese Academy of Sciences, China
Yicheng Zhang, George Mason University, USA
Junior PC
Luke Beckwith, PQSecure Technologies, USA
Yanxiang Bi, The Chinese University of Hong Kong, Hong Kong
Xiaoyu Cheng, Southeast University, China
Weimin Fu, Lehigh University, USA
Cheng Gu, University of Rochester, USA
Arnabjyoti Kalita, University of Virginia, USA
Jiwon Kim, Purdue University, USA
Junpeng Wan, Purdue University, USA
Yang Yang, University of Virginia, USA
Yuhui Zhu, Scuola Superiore Sant'Anna and Scuola IMT Alti Studi Lucca, Italy
Erfan Iravani Mohammadabadi, Virginia Tech, USA